Ultra Mark III Femtosecond (FS) Laser

Ultra Mark III Femtosecond (FS) Laser

Micron-Level Precision for the Most Demanding Applications

Key Features

• Sharper than nanosecond lasers: crisp, detailed marks with no blur or melting

• Cold Processing: no thermal damage, cracks, or chipping on fragile materials

• Multi-material and 3D surface support (5-axis) – glass, ceramics, metals, polymers

• Visible or invisible marking for traceability and security

• Clean & low maintenance – no consumables, no chemicals

Core Specifications

• Tunable pulse: 250 fs – 10 ps, up to 0.4 mJ

• Advanced control: BiBurst & FEC

• Compact, durable design for 24/7 operation

• Excellent stability: <0.5% power variation, high beam quality

Applications

• Medical: Stent manufacturing, surgical tools, burr-free precision micromachining

• Electronics & Semiconductors: Microvias in HDI PCBs, wafer dicing, thin film removal

• Automotive & Aerospace: Fuel injector nozzles, turbine cooling holes

• Displays & Consumer Electronics: OLED panel cutting, precision glass drilling, sensor windows

• Photovoltaics: Selective laser ablation, glass structuring/texturing

• Luxury Goods & Watches: Burr-free cutting, micro-welding, micromachining